WEEK 5 & 6

OBJECTIVE :

1.      Finalize sensor probe design

PROCEDURE :

•        Below is the back side of SMT package LED. this package quite difficult to solder because of the size but it its excel in-term of  performance and for sensor placement.

       

•   Then technique to solder SMT package is, first to put a bit of solder iron to make it easy to stick later on

•            This is where the LED will be placed 

       

• Below shows the connection of RED and INFRARED LED. The red wire soldered to red led and the green wire is ground while the orange wire soldered to infrared led

• Below is Light to Frequency sensor TSL235R 

• As usual the red for VCC, green for ground and  orange wire is the output of the sensor to be connected to DSPIC30F2012 later

•  By using a velcro tape. Two hole is made using puncher, one for sensor TRL235R and the other for red and infrared LED

• There are 5 wire all together (LED+SENSOR). by using DB9 connector it is more durable and easy to connect to the main board

CONCLUSION

• SMT LED package need more practice to solder. The overall process took two weeks to finished